Issued Patents 2003
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6638411 | Method and apparatus for plating substrate with copper | Koji Mishima, Mizuki Nagai, Ryoichi Kimizuka, Hisashi Kaneko | 2003-10-28 |
| 6632335 | Plating apparatus | Junji Kunisawa, Mitsuko Odagaki, Natsuki Makino, Koji Mishima, Kenji Nakamura +7 more | 2003-10-14 |
| 6632476 | Substrate processing method and substrate processing apparatus | Hiroko Nakamura, Hisashi Kaneko | 2003-10-14 |
| 6611060 | Semiconductor device having a damascene type wiring layer | Hiroshi Toyoda, Hiroyuki Yano, Gaku Minamihaba, Dai Fukushima, Hisashi Kaneko | 2003-08-26 |
| 6579785 | Method of making multi-level wiring in a semiconductor device | Hiroshi Toyoda, Hisashi Kaneko, Hideaki Hirabayashi | 2003-06-17 |
| 6563308 | Eddy current loss measuring sensor, thickness measuring system, thickness measuring method, and recorded medium | Osamu Nagano, Yuichiro Yamazaki, Motosuke Miyoshi, Hisashi Kaneko | 2003-05-13 |
| 6518177 | Method of manufacturing a semiconductor device | Takashi Kawanoue, Junichi Wada, Hisashi Kaneko | 2003-02-11 |