Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6638411 | Method and apparatus for plating substrate with copper | Koji Mishima, Mizuki Nagai, Tetsuo Matsuda, Hisashi Kaneko | 2003-10-28 |
| 6627066 | Method of measuring the concentration of a leveler in a plating liquid | Yasushi Isayama, Hiroyuki Ueyama, Hiroyuki Kaneko, Junitsu Yamakawa, Akihisa Hongo +1 more | 2003-09-30 |
| 6517894 | Method for plating a first layer on a substrate and a second layer on the first layer | Akihisa Hongo, Mizuki Nagai, Kanji Ohno, Megumi Maruyama | 2003-02-11 |
| 6518182 | Via-filling process | Masami Ishikawa, Hideki Hagiwara | 2003-02-11 |