AH

Akihisa Hongo

EB Ebara: 7 patents #2 of 257Top 1%
Overall (2003): #4,716 of 273,478Top 2%
7
Patents 2003

Issued Patents 2003

Showing 1–7 of 7 patents

Patent #TitleCo-InventorsDate
6627066 Method of measuring the concentration of a leveler in a plating liquid Yasushi Isayama, Hiroyuki Ueyama, Hiroyuki Kaneko, Junitsu Yamakawa, Ryoichi Kimizuka +1 more 2003-09-30
6615854 Wafer cleaning apparatus Shinya Morisawa 2003-09-09
6582580 Substrate plating apparatus Kenichi Suzuki, Atsushi Chono 2003-06-24
6558518 Method and apparatus for plating substrate and plating facility Satoshi Sendai, Kenya Tomioka, Katsumi Tsuda, Masayuki Kumekawa, Naoaki Ogure +1 more 2003-05-06
6544585 Method and apparatus for plating a substrate Fumio Kuriyama, Hiroaki Inoue, Tsuyoshi Tokuoka 2003-04-08
6517689 Plating device Kenichi Suzuki, Atsushi Chono, Mitsuo Tada, Akira Ogata, Satoshi Sendai +1 more 2003-02-11
6517894 Method for plating a first layer on a substrate and a second layer on the first layer Mizuki Nagai, Kanji Ohno, Ryoichi Kimizuka, Megumi Maruyama 2003-02-11