Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6638411 | Method and apparatus for plating substrate with copper | Koji Mishima, Ryoichi Kimizuka, Tetsuo Matsuda, Hisashi Kaneko | 2003-10-28 |
| 6517894 | Method for plating a first layer on a substrate and a second layer on the first layer | Akihisa Hongo, Kanji Ohno, Ryoichi Kimizuka, Megumi Maruyama | 2003-02-11 |