Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6580169 | Method for forming bumps, semiconductor device, and solder paste | Seiki Sakuyama, Yasuo Yamagishi | 2003-06-17 |
| 6535002 | IC socket, a test method using the same and an IC socket mounting mechanism | Makoto Haseyama, Shigeyuki Maruyama, Futoshi Fukaya | 2003-03-18 |
| 6528346 | Bump-forming method using two plates and electronic device | Masayuki Ochiai, Hidefumi Ueda, Michio Sono, Ichiro Yamaguchi, Kazuhiko Mitobe +4 more | 2003-03-04 |
| 6518163 | Method for forming bumps, semiconductor device, and solder paste | Seiki Sakuyama, Yasuo Yamagishi | 2003-02-11 |