Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6670264 | Method of making electrode-to-electrode bond structure and electrode-to-electrode bond structure made thereby | Nobuhiro Imaizumi, Tomohisa Yagi | 2003-12-30 |
| 6630742 | Method for forming bumps, semiconductor device, and solder paste | — | 2003-10-07 |
| 6580169 | Method for forming bumps, semiconductor device, and solder paste | Yasuo Yamagishi, Masataka Mizukoshi | 2003-06-17 |
| 6524943 | Method of forming metal bumps | — | 2003-02-25 |
| 6518163 | Method for forming bumps, semiconductor device, and solder paste | Yasuo Yamagishi, Masataka Mizukoshi | 2003-02-11 |