Issued Patents 2003
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6662345 | Method and apparatus for designing printed-circuit board | Hiroki Uchida | 2003-12-09 |
| 6596094 | Solder paste and electronic device | Masayuki Ochiai, Hiroki Uchida, Masayuki Kitajima, Masakazu Takesue, Tadaaki Shono | 2003-07-22 |
| 6580169 | Method for forming bumps, semiconductor device, and solder paste | Seiki Sakuyama, Masataka Mizukoshi | 2003-06-17 |
| 6528346 | Bump-forming method using two plates and electronic device | Masayuki Ochiai, Hidefumi Ueda, Michio Sono, Ichiro Yamaguchi, Kazuhiko Mitobe +4 more | 2003-03-04 |
| 6518163 | Method for forming bumps, semiconductor device, and solder paste | Seiki Sakuyama, Masataka Mizukoshi | 2003-02-11 |
| 6504966 | Optical deflecting element, optical switch module, light signal switching device | Masayuki Kato, Akio Sugama, Koji Tsukamoto, Masatoshi Ishii, Kishio Yokouchi +2 more | 2003-01-07 |