Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6596094 | Solder paste and electronic device | Masayuki Ochiai, Yasuo Yamagishi, Hiroki Uchida, Masayuki Kitajima, Tadaaki Shono | 2003-07-22 |
| 6541898 | Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method | Masayuki Kitajima, Yutaka Noda, Seiichi Shimoura, Toru Okada, Masanao Fujii +4 more | 2003-04-01 |
| 6521176 | Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy | Masayuki Kitajima, Yasuo Moriya, Yoshinori Nemoto, Yumiko Fukushima | 2003-02-18 |