Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6596094 | Solder paste and electronic device | Yasuo Yamagishi, Hiroki Uchida, Masayuki Kitajima, Masakazu Takesue, Tadaaki Shono | 2003-07-22 |
| 6528346 | Bump-forming method using two plates and electronic device | Hidefumi Ueda, Michio Sono, Ichiro Yamaguchi, Kazuhiko Mitobe, Koki Otake +4 more | 2003-03-04 |