Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656291 | Solder paste and soldering method of the same | — | 2003-12-02 |
| 6528346 | Bump-forming method using two plates and electronic device | Masayuki Ochiai, Michio Sono, Ichiro Yamaguchi, Kazuhiko Mitobe, Koki Otake +4 more | 2003-03-04 |