Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6494358 | Bump bonding apparatus and method | Shoriki Narita, Takaharu Mae, Shinji Kanayama, Nobuhisa Watanabe | 2002-12-17 |
| 6481616 | Bump bonding device and bump bonding method | Akihiro Yamamoto, Hiroyuki Otani, Shinzo Eguchi, Takahiro Yonezawa, Kazushi Higashi +2 more | 2002-11-19 |
| 6392202 | Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer | Shoriki Narita, Takaharu Mae, Nobuhisa Watanabe, Shinji Kanayama | 2002-05-21 |