Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6481616 | Bump bonding device and bump bonding method | Makoto Imanishi, Akihiro Yamamoto, Hiroyuki Otani, Shinzo Eguchi, Kazushi Higashi +2 more | 2002-11-19 |
| 6474538 | Bonding apparatus and bonding method | Akihiro Yamamoto, Hiroyuki Kiyomura, Tetsuya Tokunaga, Tatsuo Sasaoka, Masahiko Hashimoto | 2002-11-05 |