Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6481616 | Bump bonding device and bump bonding method | Makoto Imanishi, Akihiro Yamamoto, Shinzo Eguchi, Takahiro Yonezawa, Kazushi Higashi +2 more | 2002-11-19 |
| 6467670 | Method and apparatus for mounting component | Kazushi Higashi, Shozo Minamitani, Shinji Kanayama, Kenji Takahashi | 2002-10-22 |
| 6453811 | Printing method and printing apparatus | Takaaki Higashida, Takahiko Iwaki | 2002-09-24 |