Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6481616 | Bump bonding device and bump bonding method | Makoto Imanishi, Akihiro Yamamoto, Hiroyuki Otani, Shinzo Eguchi, Takahiro Yonezawa +2 more | 2002-11-19 |
| 6467670 | Method and apparatus for mounting component | Hiroyuki Otani, Shozo Minamitani, Shinji Kanayama, Kenji Takahashi | 2002-10-22 |
| 6439447 | Bump joining judging device and method, and semiconductor component production device and method | Shozo Minamitani, Kenji Takahashi, Shinji Kanayama, Hiroshi Wada, Takafumi Tsujisawa +4 more | 2002-08-27 |