Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6481616 | Bump bonding device and bump bonding method | Makoto Imanishi, Akihiro Yamamoto, Hiroyuki Otani, Takahiro Yonezawa, Kazushi Higashi +2 more | 2002-11-19 |
| 6439447 | Bump joining judging device and method, and semiconductor component production device and method | Shozo Minamitani, Kazushi Higashi, Kenji Takahashi, Shinji Kanayama, Hiroshi Wada +4 more | 2002-08-27 |