Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6494358 | Bump bonding apparatus and method | Shoriki Narita, Makoto Imanishi, Takaharu Mae, Nobuhisa Watanabe | 2002-12-17 |
| 6467158 | Component feeder with load position alignment recognition | Hiroyuki Kiyomura, Nobuya Matsumura, Kenji Takahashi, Hiroshi Nasu | 2002-10-22 |
| 6467670 | Method and apparatus for mounting component | Kazushi Higashi, Hiroyuki Otani, Shozo Minamitani, Kenji Takahashi | 2002-10-22 |
| 6439447 | Bump joining judging device and method, and semiconductor component production device and method | Shozo Minamitani, Kazushi Higashi, Kenji Takahashi, Hiroshi Wada, Takafumi Tsujisawa +4 more | 2002-08-27 |
| 6392202 | Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer | Shoriki Narita, Makoto Imanishi, Takaharu Mae, Nobuhisa Watanabe | 2002-05-21 |