Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6494358 | Bump bonding apparatus and method | Shoriki Narita, Makoto Imanishi, Takaharu Mae, Shinji Kanayama | 2002-12-17 |
| 6484252 | Microprocessor with improved instruction cycle using time-compressed fetching | — | 2002-11-19 |
| 6392202 | Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer | Shoriki Narita, Makoto Imanishi, Takaharu Mae, Shinji Kanayama | 2002-05-21 |