Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6494358 | Bump bonding apparatus and method | Makoto Imanishi, Takaharu Mae, Shinji Kanayama, Nobuhisa Watanabe | 2002-12-17 |
| 6392202 | Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer | Makoto Imanishi, Takaharu Mae, Nobuhisa Watanabe, Shinji Kanayama | 2002-05-21 |