Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6467670 | Method and apparatus for mounting component | Kazushi Higashi, Hiroyuki Otani, Shinji Kanayama, Kenji Takahashi | 2002-10-22 |
| 6439447 | Bump joining judging device and method, and semiconductor component production device and method | Kazushi Higashi, Kenji Takahashi, Shinji Kanayama, Hiroshi Wada, Takafumi Tsujisawa +4 more | 2002-08-27 |