Issued Patents 2002
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6475323 | Method and apparatus for separating composite member using fluid | Kazuaki Ohmi, Takao Yonehara, Kazutaka Yanagita | 2002-11-05 |
| 6468923 | Method of producing semiconductor member | Takao Yonehara, Kunio Watanabe, Tetsuya Shimada, Kazuaki Ohmi | 2002-10-22 |
| 6452091 | Method of producing thin-film single-crystal device, solar cell module and method of producing the same | Katsumi Nakagawa, Takao Yonehara, Yasuyoshi Takai, Noritaka Ukiyo, Masaaki Iwane +1 more | 2002-09-17 |
| 6448155 | Production method of semiconductor base material and production method of solar cell | Yukiko Iwasaki, Takao Yonehara, Shoji Nishida, Noritaka Ukiyo | 2002-09-10 |
| 6436226 | Object separating apparatus and method, and method of manufacturing semiconductor substrate | Kazuaki Omi, Takao Yonehara, Kazutaka Yanagita | 2002-08-20 |
| 6427747 | Apparatus and method of separating sample and substrate fabrication method | Kazuaki Omi, Takao Yonehara, Kazutaka Yanagita | 2002-08-06 |
| 6429095 | Semiconductor article and method of manufacturing the same | Takao Yonehara | 2002-08-06 |
| 6428620 | Substrate processing method and apparatus and SOI substrate | Kenji Yamagata | 2002-08-06 |
| 6427748 | Sample processing apparatus and method | Kazutaka Yanagita, Takao Yonehara, Kazuaki Omi | 2002-08-06 |
| 6426270 | Substrate processing method and method of manufacturing semiconductor substrate | Kazuaki Ohmi, Kazutaka Yanagita | 2002-07-30 |
| 6418999 | Sample separating apparatus and method, and substrate manufacturing method | Kazutaka Yanagita, Takao Yonehara, Kazuaki Omi | 2002-07-16 |
| 6417069 | Substrate processing method and manufacturing method, and anodizing apparatus | Satoshi Matsumura, Kenji Yamagata | 2002-07-09 |
| 6391743 | Method and apparatus for producing photoelectric conversion device | Masaaki Iwane, Takao Yonehara, Kazuaki Ohmi, Shoji Nishida, Kazutaka Yanagita | 2002-05-21 |
| 6391067 | Wafer processing apparatus and method, wafer convey robot, semiconductor substrate fabrication method, and semiconductor fabrication apparatus | Kazutaka Yanagita | 2002-05-21 |
| 6382292 | Method and apparatus for separating composite member using fluid | Kazuaki Ohmi, Takao Yonehara, Kazutaka Yanagita | 2002-05-07 |
| 6380099 | Porous region removing method and semiconductor substrate manufacturing method | Kazutaka Yanagita | 2002-04-30 |
| 6376332 | Composite member and separating method therefor, bonded substrate stack and separating method therefor, transfer method for transfer layer, and SOI substrate manufacturing method | Kazutaka Yanagita, Kazuaki Ohmi, Hirokazu Kurisu | 2002-04-23 |
| 6350703 | Semiconductor substrate and production method thereof | Nobuhiko Sato | 2002-02-26 |
| 6350702 | Fabrication process of semiconductor substrate | Takao Yonehara | 2002-02-26 |
| 6342433 | Composite member its separation method and preparation method of semiconductor substrate by utilization thereof | Kazuaki Ohmi, Kazutaka Yanagita | 2002-01-29 |
| 6337030 | Wafer processing apparatus, wafer processing method, and SOI wafer fabrication method | — | 2002-01-08 |