Issued Patents 2002
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6462421 | Multichip module | Kao-Yu Hsu | 2002-10-08 |
| 6461897 | Multichip module having a stacked chip arrangement | Chun-Hung Lin, Kuang-Hui Chen, Shyh-Wei Wang | 2002-10-08 |
| 6392424 | Press plate of wire bond checking system | Chin-Chen Wang, Yao-Hsin Feng | 2002-05-21 |
| 6369439 | Strip of semiconductor package | Kuo-Pin Yang, Tai-Chun Huang | 2002-04-09 |
| 6359340 | Multichip module having a stacked chip arrangement | Chun-Hung Lin, Kuang-Hui Chen, Shyh-Wei Wang, Jian Chen | 2002-03-19 |
| 6348729 | Semiconductor chip package and manufacturing method thereof | Sai LI, Chun-Hung Lin, Shin-Hua Chao | 2002-02-19 |
| 6342443 | Method and structure for forming flip chip with collapse-controlled solder bumps on a substrate | Wei-Chung Wang, Jen-Kuang Fang | 2002-01-29 |