Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6483187 | Heat-spread substrate | Kuan-Neng Liao, Yao-Hsin Feng, Hou-Chang Kuo | 2002-11-19 |
| 6355499 | Method of making ball grid array package | Shyh-Ing Wu, Yao-Shin Fang | 2002-03-12 |
| 6348729 | Semiconductor chip package and manufacturing method thereof | Sai LI, Chun-Hung Lin, Su Tao | 2002-02-19 |