Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6483187 | Heat-spread substrate | Shin-Hua Chao, Kuan-Neng Liao, Hou-Chang Kuo | 2002-11-19 |
| 6429049 | Laser method for forming vias | Chun-Chi Lee, Jaw-Shiun Hsieh, Shyh-Ing Wu, Kuan-Neng Liao, Chin-Pei Tien | 2002-08-06 |
| 6392424 | Press plate of wire bond checking system | Chin-Chen Wang, Su Tao | 2002-05-21 |