Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6469399 | Semiconductor package | Jen-Kuang Fang | 2002-10-22 |
| 6429049 | Laser method for forming vias | Jaw-Shiun Hsieh, Yao-Hsin Feng, Shyh-Ing Wu, Kuan-Neng Liao, Chin-Pei Tien | 2002-08-06 |
| 6420244 | Method of making wafer level chip scale package | — | 2002-07-16 |