Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6469399 | Semiconductor package | Chun-Chi Lee | 2002-10-22 |
| 6342443 | Method and structure for forming flip chip with collapse-controlled solder bumps on a substrate | Su Tao, Wei-Chung Wang | 2002-01-29 |