Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6383846 | Method and apparatus for molding a flip chip semiconductor device | Chi-Chih Shen, Chun-Hung Lin | 2002-05-07 |
| 6342443 | Method and structure for forming flip chip with collapse-controlled solder bumps on a substrate | Su Tao, Jen-Kuang Fang | 2002-01-29 |