Issued Patents 2002
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6461897 | Multichip module having a stacked chip arrangement | Kuang-Hui Chen, Shyh-Wei Wang, Su Tao | 2002-10-08 |
| 6455353 | Method of making semiconductor packages at wafer level | — | 2002-09-24 |
| 6413801 | Method of molding semiconductor device and molding die for use therein | — | 2002-07-02 |
| 6383846 | Method and apparatus for molding a flip chip semiconductor device | Chi-Chih Shen, Wei-Chung Wang | 2002-05-07 |
| 6359340 | Multichip module having a stacked chip arrangement | Kuang-Hui Chen, Shyh-Wei Wang, Su Tao, Jian Chen | 2002-03-19 |
| 6353095 | Ketoaldonic acids having formed stereogenic centers of R configuration: methods and compositions | Chi-Huey Wong | 2002-03-05 |
| 6348729 | Semiconductor chip package and manufacturing method thereof | Sai LI, Shin-Hua Chao, Su Tao | 2002-02-19 |
| 6348399 | Method of making chip scale package | — | 2002-02-19 |
| 6341769 | Non-contact pick-up device | Tzer-Kun Lin, Yun-Chuan Tu, Hann-Tsong Wang, Chin-Ching Wu | 2002-01-29 |
| 6338813 | Molding method for BGA semiconductor chip package | Kao-Yu Hsu, Tao-Yu Chen | 2002-01-15 |