Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6365966 | Stacked chip scale package | Sung-Fei Wang | 2002-04-02 |
| 6359340 | Multichip module having a stacked chip arrangement | Chun-Hung Lin, Kuang-Hui Chen, Shyh-Wei Wang, Su Tao | 2002-03-19 |