Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6482675 | Substrate strip for use in packaging semiconductor chips and method for making the substrate strip | Shih-Chang Lee, Wei-Chun Kung | 2002-11-19 |
| 6462421 | Multichip module | Su Tao | 2002-10-08 |
| 6380002 | Method for fabricating a flexible substrate based ball grid array (BGA) package | Shih-Chang Lee | 2002-04-30 |
| 6338813 | Molding method for BGA semiconductor chip package | Chun-Hung Lin, Tao-Yu Chen | 2002-01-15 |