Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6482675 | Substrate strip for use in packaging semiconductor chips and method for making the substrate strip | Kao-Yu Hsu, Wei-Chun Kung | 2002-11-19 |
| 6465277 | Molding apparatus and molding method for flexible substrate based package | Gwo-Liang Weng | 2002-10-15 |
| 6380002 | Method for fabricating a flexible substrate based ball grid array (BGA) package | Kao-Yu Hsu | 2002-04-30 |