Issued Patents 1994
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5366906 | Wafer level integration and testing | Robert J. Wojnarowski, Wolfgang Daum, Bernard Gorowitz, Eric J. Wildi, Michael Gdula +2 more | 1994-11-22 |
| 5336928 | Hermetically sealed packaged electronic system | Robert J. Wojnarowski | 1994-08-09 |
| 5304847 | Direct thermocompression bonding for thin electronic power chips | Homer H. Glascock, II, Kyung Wook Paik, James G. McMullen | 1994-04-19 |
| 5293070 | Integrated heat sink having a sinuous fluid channel for the thermal dissipation of semiconductor modules | James F. Burgess, Wivina A. A. Rik DeDoncker, Donald W. Jones | 1994-03-08 |
| 5291066 | Moisture-proof electrical circuit high density interconnect module and method for making same | Herbert S. Cole, Eugene L. Bartels, Raymond Albert Fillion | 1994-03-01 |