Issued Patents 1994
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5366906 | Wafer level integration and testing | Robert J. Wojnarowski, Constantine A. Neugebauer, Bernard Gorowitz, Eric J. Wildi, Michael Gdula +2 more | 1994-11-22 |
| 5353498 | Method for fabricating an integrated circuit module | Raymond Albert Fillion, Robert J. Wojnarowski, Michael Gdula, Herbert S. Cole, Jr., Eric J. Wildi | 1994-10-11 |
| 5352629 | Process for self-alignment and planarization of semiconductor chips attached by solder die adhesive to multi-chip modules | Kyung Wook Paik, William Andrew Hennessy | 1994-10-04 |