Issued Patents 1994
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5352629 | Process for self-alignment and planarization of semiconductor chips attached by solder die adhesive to multi-chip modules | Kyung Wook Paik, Wolfgang Daum | 1994-10-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5352629 | Process for self-alignment and planarization of semiconductor chips attached by solder die adhesive to multi-chip modules | Kyung Wook Paik, Wolfgang Daum | 1994-10-04 |