Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5352629 | Process for self-alignment and planarization of semiconductor chips attached by solder die adhesive to multi-chip modules | William Andrew Hennessy, Wolfgang Daum | 1994-10-04 |
| 5304847 | Direct thermocompression bonding for thin electronic power chips | Constantine A. Neugebauer, Homer H. Glascock, II, James G. McMullen | 1994-04-19 |