Issued Patents 1994
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5304847 | Direct thermocompression bonding for thin electronic power chips | Constantine A. Neugebauer, Kyung Wook Paik, James G. McMullen | 1994-04-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5304847 | Direct thermocompression bonding for thin electronic power chips | Constantine A. Neugebauer, Kyung Wook Paik, James G. McMullen | 1994-04-19 |