Issued Patents 1994
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5366906 | Wafer level integration and testing | Constantine A. Neugebauer, Wolfgang Daum, Bernard Gorowitz, Eric J. Wildi, Michael Gdula +2 more | 1994-11-22 |
| 5359496 | Hermetic high density interconnected electronic system | William P. Kornrumpf, Charles W. Eichelberger | 1994-10-25 |
| 5357403 | Adaptive lithography in a high density interconnect structure whose signal layers have fixed patterns | Theodore R. Haller | 1994-10-18 |
| 5353498 | Method for fabricating an integrated circuit module | Raymond Albert Fillion, Michael Gdula, Herbert S. Cole, Jr., Eric J. Wildi, Wolfgang Daum | 1994-10-11 |
| 5355102 | HDI impedance matched microwave circuit assembly | William P. Kornrumpf, Charles W. Eichelberger | 1994-10-11 |
| 5353195 | Integral power and ground structure for multi-chip modules | Raymond Albert Fillion | 1994-10-04 |
| 5348607 | High density interconnect thermoplastic die attach material and solvent die attach processing | Charles W. Eichelberger | 1994-09-20 |
| 5336928 | Hermetically sealed packaged electronic system | Constantine A. Neugebauer | 1994-08-09 |
| 5331203 | High density interconnect structure including a chamber | Charles W. Eichelberger, William P. Kornrumpf | 1994-07-19 |
| 5324687 | Method for thinning of integrated circuit chips for lightweight packaged electronic systems | — | 1994-06-28 |
| 5302547 | Systems for patterning dielectrics by laser ablation | Herbert S. Cole, Jr., Richard Joseph Saia, Thomas Bert Gorczyca, Ernest Wayne Balch | 1994-04-12 |