Issued Patents 1994
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5359496 | Hermetic high density interconnected electronic system | William P. Kornrumpf, Robert J. Wojnarowski | 1994-10-25 |
| 5355102 | HDI impedance matched microwave circuit assembly | William P. Kornrumpf, Robert J. Wojnarowski | 1994-10-11 |
| 5348607 | High density interconnect thermoplastic die attach material and solvent die attach processing | Robert J. Wojnarowski | 1994-09-20 |
| 5331203 | High density interconnect structure including a chamber | Robert J. Wojnarowski, William P. Kornrumpf | 1994-07-19 |