Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5338975 | High density interconnect structure including a spacer structure and a gap | James Wilson Rose | 1994-08-16 |
| 5291066 | Moisture-proof electrical circuit high density interconnect module and method for making same | Constantine A. Neugebauer, Eugene L. Bartels, Raymond Albert Fillion | 1994-03-01 |