LF

Lei Feng

ZC Zhuhai Access Semiconductor Co.: 29 patents #3 of 20Top 15%
SB Signify Holding B.V.: 7 patents #122 of 1,458Top 9%
BO BOE: 7 patents #2,731 of 12,373Top 25%
HC Honor Device Co.: 6 patents #39 of 806Top 5%
Philips: 6 patents #792 of 7,731Top 15%
CC Chengdu Boe Optoelectronics Technology Co.: 5 patents #377 of 1,466Top 30%
PB Philips Lighting Holding B.V.: 4 patents #138 of 962Top 15%
EM Emc: 3 patents #978 of 3,345Top 30%
Huawei: 3 patents #4,041 of 15,535Top 30%
DC Data Systems Co.: 3 patents #3 of 17Top 20%
VT Via Technologies: 3 patents #252 of 1,108Top 25%
IN Intel: 3 patents #10,349 of 30,777Top 35%
BC Beijing Baidu Netcom Science Technology Co.: 2 patents #457 of 1,823Top 30%
CS Casco Signal: 2 patents #12 of 136Top 9%
HC Hefei Xinsheng Optoelectronics Technology Co.: 2 patents #476 of 1,065Top 45%
JU Jiangnan University: 2 patents #248 of 1,321Top 20%
DC Digiwin Co.: 2 patents #3 of 9Top 35%
ZT Zte: 2 patents #863 of 3,593Top 25%
GE: 1 patents #19,878 of 36,430Top 55%
Ericsson: 1 patents #181 of 421Top 45%
BC Beijing Sogou Technology Development Co.: 1 patents #20 of 70Top 30%
BT Beijing University Of Posts And Telecommunications: 1 patents #123 of 333Top 40%
CC Changzhou Globe Co.: 1 patents #7 of 23Top 35%
DC Digiwin Software Co.: 1 patents #4 of 13Top 35%
EC Emc Ip Holding Company: 1 patents #2,584 of 4,608Top 60%
HU Henan Polytechnic University: 1 patents #9 of 128Top 8%
Koniniklijke Philips N.V.: 1 patents #4,025 of 7,486Top 55%
ML Meiragtx Uk Ii Limited: 1 patents #6 of 7Top 90%
Sharp Kabushiki Kaisha: 1 patents #6,861 of 10,731Top 65%
SS St-Ericsson Sa: 1 patents #279 of 771Top 40%
SP Sunbeam Products: 1 patents #298 of 575Top 55%
TE Tencent: 1 patents #4,257 of 8,131Top 55%
CU Columbia University: 1 patents #1,151 of 2,492Top 50%
ZU Zhejiang University: 1 patents #773 of 2,379Top 35%
CI Cisco: 1 patents #7,901 of 13,007Top 65%
📍 Shanghai, OR: #2 of 14 inventorsTop 15%
Overall (All Time): #12,308 of 4,157,543Top 1%
108
Patents All Time

Issued Patents All Time

Showing 26–50 of 108 patents

Patent #TitleCo-InventorsDate
12182009 Method, electronic device, and storage medium for locating fault information Yang Peng, Zhenxing Cao, Weida Liao, Huanan Lu, Yuzhen Chen 2024-12-31
12168994 Rotating mechanism, support apparatus, and terminal with foldable screen Yameng Wei, Wei Zhang, Wenxing Yao 2024-12-17
12148676 Embedded chip package and manufacturing method thereof Xianming Chen, Jindong FENG, Benxia HUANG, Wenshi Wang 2024-11-19
12130786 Structured data analysis system and method for structured data analysis Jun Zhang, Guoxin Sun 2024-10-29
12083702 Bamboo straw machining method Jianchang Lian 2024-09-10
12074115 Heat dissipation-electromagnetic shielding embedded packaging structure, manufacturing method thereof, and substrate Xianming Chen, Bingsen Xie, Benxia HUANG 2024-08-27
12065531 Polyglycolic acid resin and production process thereof 2024-08-20
12040526 Method for manufacturing embedded package structure having air resonant cavity Xianming Chen, Benxia HUANG, Jindong FENG, Yejie HONG 2024-07-16
12040272 Connector for implementing multi-faceted interconnection Xianming Chen, Benxia HUANG, Yejie HONG 2024-07-16
12033576 Display panel and drive method therefor Shuiming Lv, Weibo Hu, Guoqiang Wu, Chungkee Cheng 2024-07-09
12015547 Method of and an arrangement for communicating by a server with a node device of a network of interconnected node devices Changjie Wang, Jaya Karthik, Ronny A. A. M. Jacobs 2024-06-18
12004395 Display substrate and display device Huatao LI, Zhiguang Zhang, Jianhang Fu 2024-06-04
12002734 Circuit prearranged heat dissipation embedded packaging structure and manufacturing method thereof Xianming Chen, Benxia HUANG, Jindong FENG, Minxiong Li, Shigui Xin +1 more 2024-06-04
11984414 Packaging structure with antenna and manufacturing method thereof Xianming Chen, Wenshi Wang, Benxia HUANG 2024-05-14
11974191 Method of and a node device for alerting node devices in a network of operatively interconnected node devices Chang Jie Wang, Gong Ming Wei 2024-04-30
11961743 Substrate manufacturing method for realizing three-dimensional packaging Xianming Chen, Yejie HONG, Benxia HUANG 2024-04-16
11942465 Embedded structure, manufacturing method thereof and substrate Xianming Chen, Bingsen Xie, Benxia HUANG, Wenshi Wang 2024-03-26
11911552 Combined bio-artificial liver support system Yi Gao, Mingxin Pan, Yang Li, Lei Cai, Guolin He +2 more 2024-02-27
11903133 Structure for embedding and packaging multiple devices by layer and method for manufacturing same Xianming Chen, Gao HUANG, Benxia HUANG, Yejie HONG 2024-02-13
11854920 Embedded chip package and manufacturing method thereof Xianming Chen, Jindong FENG, Benxia HUANG, Wenshi Wang 2023-12-26
11822121 Cavity substrate having directional optoelectronic transmission channel and manufacturing method thereof Xianming Chen, Benxia HUANG, Wenshi Wang, Lina JIANG 2023-11-21
11775309 Exception stack handling method, system, electronic device and storage medium Yang Peng, Hao Yang, Jing Zou, Hongliang Sui 2023-10-03
11769733 Package substrate Xianming Chen, Yejie HONG, Benxia HUANG 2023-09-26
11763739 Method and device for adjusting brightness and OLED display Xiaohuan Chang, Shuiming Lv, Guoqiang Wu 2023-09-19
11688338 Display device, luminance compensation circuit thereof and luminance compensation method Guoqiang Wu, Chenghao Liao, Yanni Jiang, Chungkee Cheng 2023-06-27