Issued Patents All Time
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515258 | Package substrate and manufacturing method thereof | Xianming Chen, Yejie HONG, Lei Feng | 2022-11-29 |
| 11503712 | Passive device packaging structure embedded in glass medium and method for manufacturing the same | Xianming Chen, Yejie HONG, Lei Feng | 2022-11-15 |
| 11450619 | Embedded packaging structure having shielding cavity and manufacturing method thereof | Xianming Chen, Min Gu, Lei Feng, Lina JIANG, Wenshi Wang | 2022-09-20 |
| 11399440 | Method for manufacturing coreless substrate | Xianming Chen, Jian-Hao Peng, Jida Zhang, Lei Feng, Bingsen Xie +1 more | 2022-07-26 |
| 11342273 | Package structure of integrated passive device and manufacturing method thereof, and substrate | Xianming Chen, Yejie HONG, Lei Feng, Bingsen Xie | 2022-05-24 |
| 11257713 | Interposer board without feature layer structure and method for manufacturing the same | Xianming Chen, Min Gu, Lei Feng, Bingsen Xie | 2022-02-22 |
| 11114310 | Embedded packaging method capable of realizing heat dissipation | Xianming Chen, Wenshi Wang, Weiyuan YANG, Minxiong Li, Lei Feng | 2021-09-07 |