Issued Patents All Time
Showing 26–43 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804287 | Three-dimensional memory devices and fabricating methods thereof | Zhenyu Lu, Yu Ru Huang, Qian Tao, Yushi Hu, Jun Chen +3 more | 2020-10-13 |
| 10796993 | Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof | Jun Chen, Si Ping Hu, Zhenyu Lu | 2020-10-06 |
| 10784225 | Bonded semiconductor structures having bonding contacts made of indiffusible conductive materials and methods for forming the same | Zongliang Huo, Jun Liu, Jun Chen, Zi Qun Hua, Li Xiao | 2020-09-22 |
| 10763158 | Method for forming lead wires in hybrid-bonded semiconductor devices | Meng Yan, Si Ping Hu | 2020-09-01 |
| 10748851 | Hybrid bonding using dummy bonding contacts and dummy interconnects | Tao Wang, Si Ping Hu, Jia Wen Wang, Shi Qi Huang, Jun Chen +1 more | 2020-08-18 |
| 10679941 | Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof | Jun Chen, Si Ping Hu, Zhenyu Lu | 2020-06-09 |
| 10680003 | Staircase structure for memory device | Zhenyu Lu, Jun Chen, Xiaowang Dai, Qian Tao, Yu Ru Huang +6 more | 2020-06-09 |
| 10672711 | Word line contact structure for three-dimensional memory devices and fabrication methods thereof | Zhenyu Lu, Jun Chen, Si Ping Hu, Xiaowang Dai, Lan Yao +4 more | 2020-06-02 |
| 10651087 | Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof | Jun Chen, Si Ping Hu, Zhenyu Lu | 2020-05-12 |
| 10644015 | Memory cell structure of a three-dimensional memory device | Xiaowang Dai, Zhenyu Lu, Jun Chen, Qian Tao, Yushi Hu +4 more | 2020-05-05 |
| 10607887 | Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof | Jun Chen, Si Ping Hu, Zhenyu Lu | 2020-03-31 |
| 10580788 | Methods for forming three-dimensional memory devices | Jun Chen, Zhenyu Lu, Qian Tao, Si Ping Hu, Jia Wen Wang +1 more | 2020-03-03 |
| 10515975 | Method for forming dual-deck channel hole structure of three-dimensional memory device | Qian Tao, Yushi Hu, Zhenyu Lu, Li Xiao, Jun Chen +4 more | 2019-12-24 |
| 10497708 | Memory structure and forming method thereof | He Chen, Jin Wen Dong, Zi Qun Hua, Liang Xiao, Yong Qing Wang | 2019-12-03 |
| 10283452 | Three-dimensional memory devices having a plurality of NAND strings | Zhenyu Lu, Jun Chen, Yushi Hu, Qian Tao, Simon Shi-Ning Yang +1 more | 2019-05-07 |
| 9589937 | Semiconductor cooling method and method of heat dissipation | Shaoning Mei, Jun Chen, Weihua Cheng | 2017-03-07 |
| 9455221 | Preparation method of three-dimensional integrated inductor-capacitor structure | Shaoning Mei, Shaofu Ju | 2016-09-27 |
| 9455297 | Preparation process of image sensors | Siping Hu, Sheng'an Xiao, Jinwen Dong | 2016-09-27 |