Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347684 | Method and structure for cutting dense line patterns using self-aligned double patterning | Lu Fan, Bi Feng Li, Qingchen Cao, Yaobin Feng, Zhiliang Xia +1 more | 2025-07-01 |
| 12074105 | Self-aligned contacts in three-dimensional memory devices and methods for forming the same | Hongbin Zhu, Juan Tang | 2024-08-27 |
| 11710730 | Fabricating method of semiconductor device with exposed input/output pad in recess | He Chen, Shu Wu, Yong Qing Wang, Liang Xiao | 2023-07-25 |
| 11664309 | Self-aligned contacts in three-dimensional memory devices and methods for forming the same | Hongbin Zhu, Juan Tang | 2023-05-30 |
| 11552012 | Self-aligned contacts in three-dimensional memory devices and methods for forming the same | Hongbin Zhu, Juan Tang | 2023-01-10 |
| 11462503 | Hybrid bonding using dummy bonding contacts | Tao Wang, Si Ping Hu, Jia Wen Wang, Shi Qi Huang, Jifeng Zhu +1 more | 2022-10-04 |
| 11430756 | Bonded semiconductor structures having bonding contacts made of indiffusible conductive materials and methods for forming the same | Zongliang Huo, Jun Liu, Jifeng Zhu, Jun Chen, Li Xiao | 2022-08-30 |
| 11430775 | Semiconductor device with exposed input/output pad in recess | He Chen, Shu Wu, Yong Qing Wang, Liang Xiao | 2022-08-30 |
| 11251043 | Method and structure for cutting dense line patterns using self-aligned double patterning | Lu Fan, Bi Feng Li, Qingchen Cao, Yaobin Feng, Zhiliang Xia +1 more | 2022-02-15 |
| 11205619 | Hybrid bonding using dummy bonding contacts and dummy interconnects | Tao Wang, Si Ping Hu, Jia Wen Wang, Shi Qi Huang, Jifeng Zhu +1 more | 2021-12-21 |
| 11049834 | Hybrid bonding using dummy bonding contacts | Tao Wang, Si Ping Hu, Jia Wen Wang, Shi Qi Huang, Jifeng Zhu +1 more | 2021-06-29 |
| 10840125 | Memory structure and method for forming the same | Jin Wen Dong, Jun Chen, Zhiliang Xia, Jifeng Zhu, He Chen | 2020-11-17 |
| 10784225 | Bonded semiconductor structures having bonding contacts made of indiffusible conductive materials and methods for forming the same | Zongliang Huo, Jun Liu, Jifeng Zhu, Jun Chen, Li Xiao | 2020-09-22 |
| 10748851 | Hybrid bonding using dummy bonding contacts and dummy interconnects | Tao Wang, Si Ping Hu, Jia Wen Wang, Shi Qi Huang, Jifeng Zhu +1 more | 2020-08-18 |
| 10727056 | Method and structure for cutting dense line patterns using self-aligned double patterning | Lu Fan, Bi Feng Li, Qingchen Cao, Yaobin Feng, Zhiliang Xia +1 more | 2020-07-28 |
| 10497708 | Memory structure and forming method thereof | He Chen, Jin Wen Dong, Jifeng Zhu, Liang Xiao, Yong Qing Wang | 2019-12-03 |