Issued Patents All Time
Showing 26–28 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7433555 | Optoelectronic device chip having a composite spacer structure and method making same | Hsiao-Wen Lee, Peter Zung, Tzy-Ying Lin, Chia-Yang Chang, Chien-Pang Lin | 2008-10-07 |
| 7187078 | Bump structure | Huei-Mei Yu, Chia-Jen Cheng, Chun-Yen Lo, Li-Hsin Tseng, Boe Su +1 more | 2007-03-06 |
| 7122458 | Method for fabricating pad redistribution layer | Chia-Jen Cheng, Hui-Mei Yu, Li-Hsin Tseng, Ching-Chiang WU, Chun-Yen Lo +2 more | 2006-10-17 |