Issued Patents All Time
Showing 176–189 of 189 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7842605 | Atomic layer profiling of diffusion barrier and metal seed layers | Anshu A. Pradhan | 2010-11-30 |
| 7781327 | Resputtering process for eliminating dielectric damage | Sridhar Karthik Kailasam, Chentao Yu, Douglas B. Hayden | 2010-08-24 |
| 7745332 | PVD-based metallization methods for fabrication of interconnections in semiconductor devices | Roey Shaviv, Alexander Dulkin, Neil Mackie, Daniel R. Juliano | 2010-06-29 |
| 7732314 | Method for depositing a diffusion barrier for copper interconnect applications | Michal Danek | 2010-06-08 |
| 7682966 | Multistep method of depositing metal seed layers | Bart J. van Schravendijk, Tom Mountsier, Wen Wu | 2010-03-23 |
| 7510634 | Apparatus and methods for deposition and/or etch selectivity | Erich R. Klawuhn, Girish Dixit | 2009-03-31 |
| 7186648 | Barrier first method for single damascene trench applications | Michal Danek | 2007-03-06 |
| 6764940 | Method for depositing a diffusion barrier for copper interconnect applications | Michal Danek | 2004-07-20 |
| 6642146 | Method of depositing copper seed on semiconductor substrates | Michal Danek, Erich R. Klawuhn | 2003-11-04 |
| 6607977 | Method of depositing a diffusion barrier for copper interconnect applications | Michal Danek, Erich R. Klawuhn | 2003-08-19 |
| 6554914 | Passivation of copper in dual damascene metalization | Ronald A. Powell, Erich R. Klawuhn, Michal Danek, Karl B. Levy, Jonathan D. Reid +2 more | 2003-04-29 |
| 6440854 | Anti-agglomeration of copper seed layers in integrated circuit metalization | — | 2002-08-27 |
| 6319842 | Method of cleansing vias in semiconductor wafer having metal conductive layer | Mukul Khosla, Lap Tam, Ronald A. Powell, Ronald D. Allen, Erich R. Klawuhn +1 more | 2001-11-20 |
| 5674572 | Enhanced adherence of diamond coatings employing pretreatment process | Vinod K. Sarin | 1997-10-07 |