Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11519074 | Plating method and recording medium | Kazutoshi Iwai, Yuichiro Inatomi, Takashi Tanaka | 2022-12-06 |
| 11004684 | Forming method of hard mask | Mitsuaki Iwashita, Takeshi Nagao, Takashi Tanaka, Koichi Yatsuda, Kazutoshi Iwai +1 more | 2021-05-11 |
| 10755973 | Metal wiring layer forming method, metal wiring layer forming apparatus and recording medium | Keiichi Fujita, Kazutoshi Iwai | 2020-08-25 |
| 10731256 | Plating apparatus, plating method, and recording medium | Kazutoshi Iwai, Yuichiro Inatomi, Takashi Tanaka | 2020-08-04 |
| 10224202 | Forming method of hard mask, forming apparatus of hard mask and recording medium | Mitsuaki Iwashita, Takeshi Nagao, Takashi Tanaka, Koichi Yatsuda, Kazutoshi Iwai +1 more | 2019-03-05 |
| 10224208 | Plating method and recording medium | Mitsuaki Iwashita, Takashi Tanaka | 2019-03-05 |
| 10179950 | Plating method, plated component, and plating system | Yuichiro Inatomi, Takashi Tanaka | 2019-01-15 |
| 10138556 | Plating method, plating apparatus, and storage medium | Takashi Tanaka, Mitsuaki Iwashita | 2018-11-27 |
| 10030308 | Plating method, plating system and storage medium | Takashi Tanaka, Yuichiro Inatomi, Yusuke Saito, Mitsuaki Iwashita | 2018-07-24 |
| 9966306 | Catalyst layer forming method, catalyst layer forming system and recording medium | Yuichiro Inatomi, Takashi Tanaka, Yusuke Saito, Kazutoshi Iwai, Mitsuaki Iwashita | 2018-05-08 |
| 9888585 | Method for manufacturing wiring structure, copper displacement plating solution, and wiring structure | Shoso Shinguhara, Kohei Ota, Mitsuaki Iwashita | 2018-02-06 |
| 9837308 | Plating method, plating system and storage medium | Takashi Tanaka, Yuichiro Inatomi, Yusuke Saito, Mitsuaki Iwashita | 2017-12-05 |
| 9725810 | Plating method, plating apparatus and storage medium | Takashi Tanaka, Mitsuaki Iwashita | 2017-08-08 |
| 9711363 | Plating method, recording medium and plating system | Mitsuaki Iwashita, Takashi Tanaka | 2017-07-18 |
| 9653354 | Metal wiring layer forming method, metal wiring layer forming apparatus, and recording medium | Takashi Tanaka, Mitsuaki Iwashita | 2017-05-16 |
| 9650717 | Pre-treatment method of plating, storage medium, and plating system | Kazutoshi Iwai, Mitsuaki Iwashita | 2017-05-16 |
| 9653350 | Pre-treatment method for plating and storage medium | Takashi Tanaka, Yusuke Saito, Mitsuaki Iwashita | 2017-05-16 |
| 9552994 | Plating apparatus, plating method, and storage medium | Yuichiro Inatomi, Takashi Tanaka, Yusuke Saito, Mitsuaki Iwashita | 2017-01-24 |
| 8741070 | Liquid processing method, liquid processing apparatus and recording medium | Tsutae Omori, Takehiko Orii, Akira Fujita | 2014-06-03 |
| 7176142 | Method of manufacturing trench structure for device | Isao Fitrianto, Isao Tsukagoshi, Keizo Hirose, Satohiko Hoshino | 2007-02-13 |