Issued Patents All Time
Showing 26–50 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10811341 | Semiconductor device with through-mold via | Dong Joo Park, Jin Seong Kim, Dae Byoung Kang, Ho Choi, Kwang Ho Kim +3 more | 2020-10-20 |
| 10794718 | Image processing apparatus, image processing method, computer program and computer readable recording medium | Hye Kyung Byun, Tae Kyu Han, Shin Hyoung Kim | 2020-10-06 |
| 10761258 | Optical sheet module and backlight unit having same | Jung-Min Lee, Hye Ryong Kim, Jee-hong Min | 2020-09-01 |
| 10700424 | Printed circuit board structure including a closed cavity | — | 2020-06-30 |
| 10534091 | Method and apparatus for generating road surface, method and apparatus for processing point cloud data, computer program, and computer readable recording medium | Hye Sun Choi, Hye Kyung Byun | 2020-01-14 |
| 10527735 | Apparatus, method, user terminal apparatus, program, and computer readable recording medium for measuring position of moving object | Hye Sun Choi, Hye Kyung Byun | 2020-01-07 |
| 10197413 | Image processing apparatus, image processing method, computer program and computer readable recording medium | Hye Kyung Byun, Tae Kyu Han, Shin Hyoung Kim | 2019-02-05 |
| 10132984 | Optical sheet assembly and backlight unit comprising same | Sung Sik Cho, Dong Cheol Lee, Tae Jun Lee, Hee Jeong Kim, Jang Hee CHO +1 more | 2018-11-20 |
| 8847372 | Exposed die overmolded flip chip package and fabrication method | Robert Francis Darveaux, Michael Barrow, Miguel A. Jimarez, Jae Dong Kim, Dae Keun Park +1 more | 2014-09-30 |
| 8541260 | Exposed die overmolded flip chip package and fabrication method | Robert Francis Darveaux, Michael Barrow, Miguel A. Jimarez, Jae Dong Kim, Dae Keun Park +1 more | 2013-09-24 |
| 8476748 | Exposed die overmolded flip chip package and fabrication method | Robert Francis Darveaux, Michael Barrow, Miguel A. Jimarez, Jae Dong Kim, Dae Keun Park +1 more | 2013-07-02 |
| 8368194 | Exposed die overmolded flip chip package | Robert Francis Darveaux, Michael Barrow, Miguel A. Jimarez, Jae Dong Kim, Dae Keun Park +1 more | 2013-02-05 |
| 8207022 | Exposed die overmolded flip chip package method | Robert Francis Darveaux, Michael Barrow, Miguel A. Jimarez, Jae Dong Kim, Dae Keun Park +1 more | 2012-06-26 |
| 7919853 | Semiconductor package and fabrication method thereof | — | 2011-04-05 |
| 7898093 | Exposed die overmolded flip chip package and fabrication method | Robert Francis Darveaux, Michael Barrow, Miguel A. Jimarez, Jae Dong Kim, Dae Keun Park +1 more | 2011-03-01 |
| 7872341 | Semiconductor device | Sang Jae Jang, Jae Dong Kim | 2011-01-18 |
| 7843052 | Semiconductor devices and fabrication methods thereof | Min Yoo, Min Jae Lee | 2010-11-30 |
| 7638983 | Controller of doubly-fed induction generator | Jung-Woo Park, Dong Wook Kim | 2009-12-29 |
| 7579702 | Electric power converting device and power converting method for controlling doubly-fed induction generator | Jung-Woo Park, Dong Wook Kim | 2009-08-25 |
| 7554194 | Thermally enhanced semiconductor package | Michael Kelly, Chang Ho Jang | 2009-06-30 |
| 6770961 | Carrier frame and semiconductor package including carrier frame | — | 2004-08-03 |
| 4934190 | Silicon-based sensors | — | 1990-06-19 |
| 4888988 | Silicon based mass airflow sensor and its fabrication method | Il Hyun Choi | 1989-12-26 |
| 4884443 | Control and detection circuitry for mass airflow sensors | Charles R. Cook Jr. | 1989-12-05 |
| 4870745 | Methods of making silicon-based sensors | — | 1989-10-03 |