WT

Wun-Kai TSAI

TSMC: 6 patents #3,824 of 12,232Top 35%
📍 Huwei, TW: #2 of 25 inventorsTop 8%
Overall (All Time): #799,467 of 4,157,543Top 20%
6
Patents All Time

Issued Patents All Time

Showing 1–6 of 6 patents

Patent #TitleCo-InventorsDate
12057301 Arcing protection method, processing tool and fabrication system Wen-Che LIANG, Chao-Keng Li, Zheng Xu, Chih-Kuo Chang, Sing-Tsung Li +2 more 2024-08-06
11721662 Wafer bonding method and wafer bonding apparatus Yun-Tai Shih, Ching-Hou Su, Chyi-Tsong Ni, I-Shi Wang, Jeng-Hao Lin +2 more 2023-08-08
11664206 Arcing protection method and processing tool Wen-Che LIANG, Chao-Keng Li, Zheng Xu, Chih-Kuo Chang, Sing-Tsung Li +2 more 2023-05-30
10847490 Bonding alignment tool Yun-Tai Shih, Kuan-Ming Pan, Jeng-Hao Lin, I-Shi Wang, Jui-Mu Cho +2 more 2020-11-24
10396054 Bonding alignment tool Yun-Tai Shih, Kuan-Ming Pan, Jeng-Hao Lin, I-Shi Wang, Jui-Mu Cho +2 more 2019-08-27
9123754 Bonding alignment tool and method Yun-Tai Shih, Kuan-Ming Pan, Jeng-Hao Lin, I-Shi Wang, Jui-Mu Cho +2 more 2015-09-01