Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721662 | Wafer bonding method and wafer bonding apparatus | Ching-Hou Su, Chyi-Tsong Ni, I-Shi Wang, Jeng-Hao Lin, Kuan-Ming Pan +2 more | 2023-08-08 |
| 10847490 | Bonding alignment tool | Kuan-Ming Pan, Jeng-Hao Lin, I-Shi Wang, Jui-Mu Cho, Ching-Hou Su +2 more | 2020-11-24 |
| 10396054 | Bonding alignment tool | Kuan-Ming Pan, Jeng-Hao Lin, I-Shi Wang, Jui-Mu Cho, Ching-Hou Su +2 more | 2019-08-27 |
| 9123754 | Bonding alignment tool and method | Kuan-Ming Pan, Jeng-Hao Lin, I-Shi Wang, Jui-Mu Cho, Ching-Hou Su +2 more | 2015-09-01 |