Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12258265 | Bonding process for forming semiconductor device structure | Chih-Hang Chang, Jen-Hao Liu | 2025-03-25 |
| 12243848 | Methods and systems for improving fusion bonding | Hong-Ta Kuo, Yen-Hao Huang, Ming-Yi Shen, Tzu-Ping Yang, Hsing-Yu Wang +4 more | 2025-03-04 |
| 11862482 | Semiconductor substrate bonding tool and methods of operation | Yen-Hao Huang, Chun-Yi Chen, Yin-Tun Chou, Yuan-Hsin Chi, Sheng Lin | 2024-01-02 |
| 11772963 | Bonding process for forming semiconductor device structure | Chih-Hang Chang, Jen-Hao Liu | 2023-10-03 |
| 11721662 | Wafer bonding method and wafer bonding apparatus | Yun-Tai Shih, Ching-Hou Su, Chyi-Tsong Ni, Jeng-Hao Lin, Kuan-Ming Pan +2 more | 2023-08-08 |
| 11695150 | Semiconductor structures having a micro-battery and methods for making the same | Chyi-Tsong Ni, Yi-Hsun Chiu, Ching-Hou Su | 2023-07-04 |
| 11655146 | Extended acid etch for oxide removal | Hong-Ta Kuo, Tzu-Ping Yang, Hsing-Yu Wang, Shu-Han CHAO, Hsi-Cheng Hsu +3 more | 2023-05-23 |
| 11211354 | Systems and methods for semi-flexible eutectic bonder piece arranegments | Chih-Hang Chang, Richard Huang, Yin-Tun Chou, Jen-Hao Liu | 2021-12-28 |
| 11192778 | MEMS package with roughend interface | Yu-Jui Chen, Ren-Dou Lee, Jen-Hao Liu | 2021-12-07 |
| 11192775 | Rough layer for better anti-stiction deposition | Chih-Hang Chang, Jen-Hao Liu | 2021-12-07 |
| 11174156 | Bonding process for forming semiconductor device structure | Chih-Hang Chang, Jen-Hao Liu | 2021-11-16 |
| 11101491 | Semiconductor structures having a micro-battery and methods for making the same | Chyi-Tsong Ni, Yi-Hsun Chiu, Ching-Hou Su | 2021-08-24 |
| 10847490 | Bonding alignment tool | Yun-Tai Shih, Kuan-Ming Pan, Jeng-Hao Lin, Jui-Mu Cho, Ching-Hou Su +2 more | 2020-11-24 |
| 10759654 | Rough anti-stiction layer for MEMS device | Yu-Jui Chen, Ren-Dou Lee, Jen-Hao Liu | 2020-09-01 |
| 10710872 | MEMS package with roughend interface | Yu-Jui Chen, Ren-Dou Lee, Jen-Hao Liu | 2020-07-14 |
| 10626010 | Bonding process for forming semiconductor device structure | Chih-Hang Chang, Jen-Hao Liu | 2020-04-21 |
| 10396054 | Bonding alignment tool | Yun-Tai Shih, Kuan-Ming Pan, Jeng-Hao Lin, Jui-Mu Cho, Ching-Hou Su +2 more | 2019-08-27 |
| 10361449 | Semiconductor structures having a micro-battery and methods for making the same | Chyi-Tsong Ni, Yi-Hsun Chiu, Ching-Hou Su | 2019-07-23 |
| 10273141 | Rough layer for better anti-stiction deposition | Chih-Hang Chang, Jen-Hao Liu | 2019-04-30 |
| 10173886 | Rough anti-stiction layer for MEMS device | Yu-Jui Chen, Ren-Dou Lee, Jen-Hao Liu | 2019-01-08 |
| 10112826 | Method for forming micro-electro-mechanical system (MEMS) device structure | Chih-Hang Chang, Jen-Hao Liu | 2018-10-30 |
| 9884755 | Rough anti-stiction layer for MEMS device | Yu-Jui Chen, Ren-Dou Lee, Jen-Hao Liu | 2018-02-06 |
| 9725312 | Preconditioning to enhance hydrophilic fusion bonding | Chien-Ning Hsin, Jen-Hao Liu, Chih-Hang Chang | 2017-08-08 |
| 9481567 | MEMS structure, cap substrate and method of fabricating the same | Yu-Jui Chen, Ting-Ying Chien, Jen-Hao Liu, Ren-Dou Lee | 2016-11-01 |
| 9444398 | Semiconductor structure and fabricating process for the same | Chyi-Tsong Ni, Yi-Hsun Chiu, Ching-Hou Su | 2016-09-13 |