Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394647 | Wafer shift detection | Ming-Sze Chen, Hung-Chih Wang, Sheng Lin | 2025-08-19 |
| 12286706 | Structures and methods for processing a semiconductor substrate | Ming-Yi Shen, Hsin-Lin WU, Yao-Fong DAI, Pei-Yuan TAI, Chin-Wei Chen +2 more | 2025-04-29 |
| 12243848 | Methods and systems for improving fusion bonding | Hong-Ta Kuo, Yen-Hao Huang, I-Shi Wang, Ming-Yi Shen, Tzu-Ping Yang +4 more | 2025-03-04 |
| 12234145 | Methods for wafer bonding | Chien-Wei Chang, Ya-Jen Sheuh, Ren-Dou Lee, Yi-Chih Chang, Yi-Hsun Chiu | 2025-02-25 |
| 12142514 | Clamp ring and method of using clamp ring | Chih-Wei Chou, Yin-Tun Chou, Hung-Chih Wang, Yu Liu, Chih-Ming Wang | 2024-11-12 |
| 12040163 | Connect structure for semiconductor processing equipment | Ming-Sze Chen, Hung-Chih Wang, Sheng Lin | 2024-07-16 |
| 12020994 | Power alarm and fire loading risk reduction for a deposition tool | Chih-Wei Chou, Sheng Lin, Yin-Tun Chou, Hung-Chih Wang, Yu Liu | 2024-06-25 |
| 12002699 | Wafer pod transfer assembly | Chih-Wei Chou, Sheng Lin, Yin-Tun Chou, Hung-Chih Wang, Yu Liu | 2024-06-04 |
| 11955317 | Radio frequency match strap assembly | Ming-Sze Chen, Yu WANG, Yin-Tun Chou, Sheng Lin | 2024-04-09 |
| 11862482 | Semiconductor substrate bonding tool and methods of operation | Yen-Hao Huang, Chun-Yi Chen, I-Shi Wang, Yin-Tun Chou, Sheng Lin | 2024-01-02 |
| 11851325 | Methods for wafer bonding | Chien-Wei Chang, Ya-Jen Sheuh, Ren-Dou Lee, Yi-Chih Chang, Yi-Hsun Chiu | 2023-12-26 |
| 11655146 | Extended acid etch for oxide removal | Hong-Ta Kuo, I-Shi Wang, Tzu-Ping Yang, Hsing-Yu Wang, Shu-Han CHAO +3 more | 2023-05-23 |
| 11600506 | Wafer pod transfer assembly | Chih-Wei Chou, Sheng Lin, Yin-Tun Chou, Hung-Chih Wang, Yu Liu | 2023-03-07 |